EN AW-5754

Material id: 1168822

8 x 1270 x 2520 mm

Plate dimension

1270 x 2520 mm

Thickness

8.0 mm

Temper

H111
  • Plate dimension: 1270 x 2520 mm
  • Thickness: 8.0 mm
  • Temper: H111
  • Weldability: High
  • Corrosion: High
  • Cut/drilling: High
  • Surface: Medium

EN AW-5754

It is sea water resistant and has an average strength, high corrosion resistance and good for welding Medium for anodizing.


We are not liable for items out of stock. The specified weight is theoretical. Please contact us if you have any further enquiries.

Alloy - Alloys

Si
Min
-
Max
0.4
Fe
Min
-
Max
0.4
Cu
Min
-
Max
0.1
Mn
Min
-
Max
0.5
Mg
Min
2.6
Max
3.6
Cr
Min
-
Max
0.3
Zn
Min
-
Max
0.2
Ti
Min
-
Max
0.15
Others
Min
0.15
Max
-

Alloy - Aluminium Properties

Alloy
EN AW-5754
Temper
Hx2
Thermal conductivity
W/m*K
132
Coefficient of thermal expansion
µm/(m*K)
23,7
Annealing
Min
-
Annealing
Max
-
Melting point
Min
595
Max
645
Melting point
Max
645
Elastic modulus
KN/mm2
70
Electrical conductivity
%IACS
32,5
Alloy
EN AW-5754
Temper
Hx4
Thermal conductivity
W/m*K
132
Coefficient of thermal expansion
µm/(m*K)
23,7
Annealing
Min
-
Annealing
Max
-
Melting point
Min
595
Max
645
Melting point
Max
645
Elastic modulus
KN/mm2
70
Electrical conductivity
%IACS
32,5
Alloy
EN AW-5754
Temper
Hx6
Thermal conductivity
W/m*K
132
Coefficient of thermal expansion
µm/(m*K)
23,7
Annealing
Min
-
Annealing
Max
-
Melting point
Min
595
Max
645
Melting point
Max
645
Elastic modulus
KN/mm2
70
Electrical conductivity
%IACS
32,5
Alloy
EN AW-5754
Temper
Hx8
Thermal conductivity
W/m*K
132
Coefficient of thermal expansion
µm/(m*K)
23,7
Annealing
Min
-
Annealing
Max
-
Melting point
Min
595
Max
645
Melting point
Max
645
Elastic modulus
KN/mm2
70
Electrical conductivity
%IACS
32,5
Alloy
EN AW-5754
Temper
Hx9
Thermal conductivity
W/m*K
-
Coefficient of thermal expansion
µm/(m*K)
23,7
Annealing
Min
-
Annealing
Max
-
Melting point
Min
595
Max
645
Melting point
Max
645
Elastic modulus
KN/mm2
70
Electrical conductivity
%IACS
-
Alloy
EN AW-5754
Temper
O
Thermal conductivity
W/m*K
132
Coefficient of thermal expansion
µm/(m*K)
23,7
Annealing
Min
-
Annealing
Max
-
Melting point
Min
595
Max
645
Melting point
Max
645
Elastic modulus
KN/mm2
70
Electrical conductivity
%IACS
32,5

Alloy - Mechanical Properties (EN 485-2:2008)

Thickness interval
Min
0.2
Max
0.5
Tensile strength (Rm) MPa
Min
190
Max
240
Proof stress (Rp0,2)
MPa
80
Elongation A50mm
% min
12
Elongation
% min
-
Bend radius 180*
t
0,5
Bend radius 90*
t
0
Brinell Hardness
HBS
52
Thickness interval
Min
0.5
Max
1.5
Tensile strength (Rm) MPa
Min
190
Max
240
Proof stress (Rp0,2)
MPa
80
Elongation A50mm
% min
14
Elongation
% min
-
Bend radius 180*
t
0,5
Bend radius 90*
t
0,5
Brinell Hardness
HBS
52
Thickness interval
Min
1.5
Max
3
Tensile strength (Rm) MPa
Min
190
Max
240
Proof stress (Rp0,2)
MPa
80
Elongation A50mm
% min
16
Elongation
% min
-
Bend radius 180*
t
1
Bend radius 90*
t
1
Brinell Hardness
HBS
52
Thickness interval
Min
3
Max
6
Tensile strength (Rm) MPa
Min
190
Max
240
Proof stress (Rp0,2)
MPa
80
Elongation A50mm
% min
18
Elongation
% min
-
Bend radius 180*
t
1
Bend radius 90*
t
1
Brinell Hardness
HBS
52
Thickness interval
Min
6
Max
12.5
Tensile strength (Rm) MPa
Min
190
Max
240
Proof stress (Rp0,2)
MPa
80
Elongation A50mm
% min
18
Elongation
% min
-
Bend radius 180*
t
-
Bend radius 90*
t
2
Brinell Hardness
HBS
52
Thickness interval
Min
12.5
Max
100
Tensile strength (Rm) MPa
Min
190
Max
240
Proof stress (Rp0,2)
MPa
80
Elongation A50mm
% min
-
Elongation
% min
17
Bend radius 180*
t
-
Bend radius 90*
t
-
Brinell Hardness
HBS
52