EN AW-1050A

6 x 1000 x 2000 mm

Plate dimension

1000 x 2000 mm

Thickness

6.0 mm

Temper

H12
  • Plate dimension: 1000 x 2000 mm
  • Thickness: 6.0 mm
  • Temper: H12
  • Weldability: High
  • Corrosion: High
  • Cut/drilling: Medium
  • Surface: High
On request

EN AW-1050A

It is the most pure form of aluminium and the most common plate alloy. The alloy has a good property regarding bending and welding, and it is suitable for surface treatment.

It contains 99.5 % aluminium, and they mainly produce it in thickness from 0.5 mm - 6 mm.

EN AW-1050A DDQ:

It contains 99,5% aluminum and is produced in a very soft temper, making it suitable for deep drawing applications. Mainly produced in thickness 1,00 mm, 1,25 m, 1,05 mm and 2,00 mm.


We are not liable for items out of stock. The specified weight is theoretical. Please contact us if you have any further enquiries.

Alloy - Alloys

Si
Min
0.25
Max
0.25
Fe
Min
-
Max
0.4
Cu
Min
0.05
Max
0.05
Mn
Min
0.01
Max
0.01
Mg
Min
0.05
Max
0.05
Zn
Min
-
Max
0.07
Ti
Min
-
Max
0.05
Others
Min
0.03
Max
-
Al
Min
99.5
Max
-

Alloy - Aluminium Properties

Alloy
EN AW-1050A
Temper
Hx2
Thermal conductivity
W/m*K
229
Coefficient of thermal expansion
µm/(m*K)
23,5
Annealing
Min
-
Annealing
Max
-
Melting point
Min
645
Max
658
Melting point
Max
658
Elastic modulus
KN/mm2
69
Electrical conductivity
%IACS
59,5

Alloy
EN AW-1050A
Temper
Hx4
Thermal conductivity
W/m*K
229
Coefficient of thermal expansion
µm/(m*K)
23,5
Annealing
Min
-
Annealing
Max
-
Melting point
Min
645
Max
658
Melting point
Max
658
Elastic modulus
KN/mm2
69
Electrical conductivity
%IACS
59,5

Alloy
EN AW-1050A
Temper
Hx6
Thermal conductivity
W/m*K
229
Coefficient of thermal expansion
µm/(m*K)
23,5
Annealing
Min
-
Annealing
Max
-
Melting point
Min
645
Max
658
Melting point
Max
658
Elastic modulus
KN/mm2
69
Electrical conductivity
%IACS
59,5

Alloy
EN AW-1050A
Temper
Hx8
Thermal conductivity
W/m*K
229
Coefficient of thermal expansion
µm/(m*K)
23,5
Annealing
Min
-
Annealing
Max
-
Melting point
Min
645
Max
658
Melting point
Max
658
Elastic modulus
KN/mm2
69
Electrical conductivity
%IACS
59,5

Alloy
EN AW-1050A
Temper
Hx9
Thermal conductivity
W/m*K
229
Coefficient of thermal expansion
µm/(m*K)
23,5
Annealing
Min
-
Annealing
Max
-
Melting point
Min
645
Max
658
Melting point
Max
658
Elastic modulus
KN/mm2
69
Electrical conductivity
%IACS
59,5

Alloy
EN AW-1050A
Temper
O
Thermal conductivity
W/m*K
229
Coefficient of thermal expansion
µm/(m*K)
23,5
Annealing
Min
-
Annealing
Max
-
Melting point
Min
645
Max
658
Melting point
Max
658
Elastic modulus
KN/mm2
69
Electrical conductivity
%IACS
59,5

Alloy - Mechanical Properties (EN 485-2:2008)

Thickness interval
Min
0.2
Max
0.5
Tensile strength (Rm) MPa
Min
85
Max
125
Proof stress (Rp0,2)
MPa
65
Elongation A50mm
% min
2
Elongation
% min
-
Bend radius 180*
t
0,5
Bend radius 90*
t
0
Brinell Hardness
HBS
28

Thickness interval
Min
0.5
Max
1.5
Tensile strength (Rm) MPa
Min
85
Max
125
Proof stress (Rp0,2)
MPa
65
Elongation A50mm
% min
4
Elongation
% min
-
Bend radius 180*
t
0,5
Bend radius 90*
t
0
Brinell Hardness
HBS
28

Thickness interval
Min
1.5
Max
3
Tensile strength (Rm) MPa
Min
85
Max
125
Proof stress (Rp0,2)
MPa
65
Elongation A50mm
% min
5
Elongation
% min
-
Bend radius 180*
t
0,5
Bend radius 90*
t
0,5
Brinell Hardness
HBS
28

Thickness interval
Min
3
Max
6
Tensile strength (Rm) MPa
Min
85
Max
125
Proof stress (Rp0,2)
MPa
65
Elongation A50mm
% min
7
Elongation
% min
-
Bend radius 180*
t
1
Bend radius 90*
t
1
Brinell Hardness
HBS
28

Thickness interval
Min
6
Max
12.5
Tensile strength (Rm) MPa
Min
85
Max
125
Proof stress (Rp0,2)
MPa
65
Elongation A50mm
% min
9
Elongation
% min
-
Bend radius 180*
t
-
Bend radius 90*
t
2
Brinell Hardness
HBS
28

Thickness interval
Min
12.5
Max
40
Tensile strength (Rm) MPa
Min
85
Max
125
Proof stress (Rp0,2)
MPa
65
Elongation A50mm
% min
-
Elongation
% min
9
Bend radius 180*
t
-
Bend radius 90*
t
-
Brinell Hardness
HBS
28