EN AW-5083

Plate length

1020 x 2020 mm

Thickness

100.0 mm

Temper

H321

We stock a wide range of plates. They are in many different alloys; however, the most common are 5754, 5083 and 6082. Do you request other thickness or alloy types than the once introduced - you are welcome to contact us.  


  • Plate length: 1020 x 2020 mm
  • Thickness: 100.0 mm
  • Temper: H321
  • Weldability: High
  • Corrosion: High
  • Cut/drilling: High
  • Surface: Medium
On request

EN AW-5083

It is sea water resistant and has an average strength, high corrosion resistance and good for welding Medium for anodizing

 


We are not liable for items out of stock. The specified weight is theoretical. Please contact us if you have any further enquiries.

Alloy - Alloys

Si
Min
-
Max
0.4
Fe
Min
-
Max
0.4
Cu
Min
-
Max
0.1
Mn
Min
0.4
Max
1
Mg
Min
4
Max
4.9
Cr
Min
0.05
Max
0.25
Zn
Min
-
Max
0.25
Ti
Min
-
Max
0.15
Others
Min
0.15
Max
-

Alloy - Aluminium Properties

Alloy
EN AW-5083
Temper
Hx2
Thermal conductivity
W/m*K
117
Coefficient of thermal expansion
µm/(m*K)
23,8
Annealing
Min
-
Annealing
Max
-
Melting point
Min
580
Max
640
Melting point
Max
640
Elastic modulus
KN/mm2
71
Electrical conductivity
%IACS
28,5
Alloy
EN AW-5083
Temper
Hx4
Thermal conductivity
W/m*K
117
Coefficient of thermal expansion
µm/(m*K)
23,8
Annealing
Min
-
Annealing
Max
-
Melting point
Min
580
Max
640
Melting point
Max
640
Elastic modulus
KN/mm2
71
Electrical conductivity
%IACS
28,5
Alloy
EN AW-5083
Temper
Hx6
Thermal conductivity
W/m*K
117
Coefficient of thermal expansion
µm/(m*K)
23,8
Annealing
Min
-
Annealing
Max
-
Melting point
Min
580
Max
640
Melting point
Max
640
Elastic modulus
KN/mm2
71
Electrical conductivity
%IACS
28,5
Alloy
EN AW-5083
Temper
Hx8
Thermal conductivity
W/m*K
117
Coefficient of thermal expansion
µm/(m*K)
23,8
Annealing
Min
-
Annealing
Max
-
Melting point
Min
580
Max
640
Melting point
Max
640
Elastic modulus
KN/mm2
71
Electrical conductivity
%IACS
28,5
Alloy
EN AW-5083
Temper
Hx9
Thermal conductivity
W/m*K
-
Coefficient of thermal expansion
µm/(m*K)
23,8
Annealing
Min
-
Annealing
Max
-
Melting point
Min
580
Max
640
Melting point
Max
640
Elastic modulus
KN/mm2
71
Electrical conductivity
%IACS
-
Alloy
EN AW-5083
Temper
O
Thermal conductivity
W/m*K
117
Coefficient of thermal expansion
µm/(m*K)
23,8
Annealing
Min
-
Annealing
Max
-
Melting point
Min
580
Max
640
Melting point
Max
640
Elastic modulus
KN/mm2
71
Electrical conductivity
%IACS
28,5

Alloy - Mechanical Properties (EN 485-2:2008)

Thickness interval
Min
1.5
Max
3
Tensile strength (Rm) MPa
Min
305
Max
-
Proof stress (Rp0,2)
MPa
215
Elongation A50mm
% min
8
Elongation
% min
-
Bend radius 180*
t
3
Bend radius 90*
t
2
Brinell Hardness
HBS
89
Thickness interval
Min
3
Max
6
Tensile strength (Rm) MPa
Min
305
Max
-
Proof stress (Rp0,2)
MPa
215
Elongation A50mm
% min
10
Elongation
% min
-
Bend radius 180*
t
-
Bend radius 90*
t
2,5
Brinell Hardness
HBS
89
Thickness interval
Min
6
Max
12.5
Tensile strength (Rm) MPa
Min
305
Max
-
Proof stress (Rp0,2)
MPa
215
Elongation A50mm
% min
12
Elongation
% min
-
Bend radius 180*
t
-
Bend radius 90*
t
4
Brinell Hardness
HBS
89
Thickness interval
Min
12.5
Max
40
Tensile strength (Rm) MPa
Min
305
Max
-
Proof stress (Rp0,2)
MPa
215
Elongation A50mm
% min
-
Elongation
% min
10
Bend radius 180*
t
-
Bend radius 90*
t
-
Brinell Hardness
HBS
89
Thickness interval
Min
40
Max
80
Tensile strength (Rm) MPa
Min
285
Max
-
Proof stress (Rp0,2)
MPa
200
Elongation A50mm
% min
-
Elongation
% min
10
Bend radius 180*
t
-
Bend radius 90*
t
-
Brinell Hardness
HBS
83